Encapsulation
Electronic components, structural reinforcements, and sensitive assemblies face constant threats from moisture, chemicals, impact, and environmental stress. Traditional protection methods often fall short when components require seamless integration into complex geometries or demand absolute reliability in harsh conditions.
Our RIM encapsulation process solves these challenges by permanently embedding components within high-performance thermoset materials, creating uncompromising protection while maintaining design freedom.
Complete Environmental Protection
The low-temperature, low-pressure RIM process safely encapsulates even the most sensitive electronic components without thermal or mechanical damage. Operating temperatures below 200°F protect delicate circuits, batteries, and sensors that would fail under traditional molding conditions.
Our polyurethane and Poly-DCPD materials create an impermeable barrier against moisture infiltration, chemical exposure, and physical impact. Components remain fully functional while gaining protection equivalent to IP67/68 environmental ratings without requiring separate housings or gaskets.
Proven Encapsulation Applications
Electronic Systems Integration We've successfully encapsulated RFID chips, PCBs, wire harnesses, LCD displays, and battery assemblies directly into structural components. The adhesive nature of our materials creates molecular bonds with most substrates, eliminating interface failures common in mechanical assemblies.
Structural Reinforcement Metal inserts, carbon fiber reinforcements, and aluminum frameworks become integral parts of the final component. This composite approach delivers structural performance impossible with polymers alone while maintaining the design flexibility that metals cannot provide.
Sensitive Component Protection Antennas, sensors, and optical elements gain complete environmental protection without signal interference or performance degradation. The low dielectric properties of our materials maintain RF transparency while providing mechanical protection.
Engineering Advantages Beyond Protection
Encapsulation eliminates assembly steps, reduces part count, and removes potential failure points at component interfaces. Complex harness routing and component positioning become molded-in features rather than secondary assembly operations.
Variable wall thickness capabilities allow selective material placement around critical components. Delicate circuits receive thin, precise coverage while structural areas maintain full material thickness for strength and rigidity.
The controlled thermal expansion of our materials prevents stress concentration around encapsulated components during temperature cycling, a common failure mode in traditional assemblies.
Material Selection for Optimal Performance
Polyurethane Systems excel in applications requiring flexibility, impact resistance, and chemical compatibility with electronic components. UL94 V-0 rated formulations meet fire safety requirements without compromising encapsulation integrity.
Poly-DCPD Materials provide superior chemical resistance and high-temperature stability for harsh industrial environments. The 7-10% weight reduction compared to traditional alternatives often eliminates the need for additional structural support.
Custom Formulations can be developed to meet specific electrical, thermal, or chemical requirements while maintaining the processing advantages of RIM encapsulation.
Process Reliability and Quality Assurance
Our ISO 9001:2015 certified processes ensure consistent encapsulation quality across production runs. Controlled material mixing and precise temperature management eliminate voids and incomplete fills that compromise component protection.
Real-time process monitoring tracks material flow patterns and cure characteristics to verify complete component coverage. This data-driven approach provides documentation for critical applications in medical, aerospace, and defense sectors.
Design Integration Support
Our engineering team works directly with your design organization to optimize component placement and material selection during the concept phase. This collaborative approach identifies potential issues before tooling commitments and ensures manufacturable designs that meet all performance requirements.
We provide comprehensive design guidelines covering minimum encapsulation thicknesses, component spacing requirements, and material flow considerations. This technical support extends through prototype validation and production ramp-up.
Ready to explore encapsulation solutions for your critical components?
Our technical team can evaluate your specific requirements and recommend the optimal material and process combination for your application.